· Prototype IC Packaging

· Repackaging of chip scale, bare die, flip chips, obsolete die, etc.

· BGA Reball/Rework

· Chemical Deprocessing

· X-Sectioning

· Reliability Testing

                  T/H 85/85

                  Preconditioning

                  Temp Cycle

                  Thermal Shock

                  Autoclave

                  High Temp Storage Life