Priority Packaging, Inc. provides integrated circuit expertise in

  Die Recovery Die repackaging FA / Qualification / Evaluation Die Repackaging  
  IC packaging IC repackaging IC Prototyping  
  IC bonding BGA reball / rework Open-cavity Assembly  
  IC Assembly Module Assembly MCM Hybrid (Laminate-Ceramic) Assembly  
  Flip-chip Assembly Stacked-Die Assembly Scanning Acoustic Microscopy (SAM C-SAM)  
  Failure Analysis Cross-sectioning X-ray (High Magnification / Resolution)  
  Chemical deprocessing Decapsulation Laser Etch, marking, ablating  
  Reliability testing Preconditioning Temperature cycling  
  Thermal shock Autoclave High-temp (temperature) storage life.  

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Priority Packaging, Inc. offers a unique opportunity to customers by merging Failure Analysis, IC Assembly and Reliability knowledge into one service offering. The combined impact of expertise in these complimentary disciplines results in the quickest and most efficient high quality solution for our customers. We invite you to visit our facility or contact one of our representatives.