Semiconductor Packaging, Reliability & Failure Analysis Services
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SERVICES

IC Prototype Packaging

IC Repackaging

BGA Reball/Rework

Reliability Testing


Services

       
BGA Reball/Rework
Scanning Acoustic Microscopy ( SAM, C-SAM)
 X-Ray, High Magnification, High Resolution
Cross-sectioning (X-Sectioning)
BGA Reball/Rework; TBGA, GBGA, cdBGA, csBGA, uBGA, nBGA
Scanning Acoustic Microscopy
(SAM, C-SAM)
X-Ray,
High Magnification,
High Resolution
Cross-sectioning
(X-Sectioning)